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Wedge bonding can be a great solution for performing low profile or fine pitch interconnects and is also well suited for running stitch interconnects (also known as die-to-die bonding and chain bonding), reverse bonding, and ribbon bonding.
Wedge bonding works by using a wedge bonder. A wire is passed through the wedge tool over the microchip. The capillary then settles over the area that need
Market research analysts at QYResearch predict that the global Wire Wedge Bonder Equipment market will grow steadily during the next five years and post a CAGR of nearly 1.04% by 2022. This market research analysis identifies the increasing design complexity of semiconductor devices as one of the primary growth factors for the global Wire Wedge Bonder Equipment market. The rise in design complexities such as slimmer version, use of metallic case, and larger displays in smartphones and other electronics has reduced the space for semiconductor components. This in turn, increases the complexity of the design and the development of semiconductor devices and increases the need for new processing tools and equipment to manufacture them. Moreover, the constant introduction of new electronics such as smartphones with improved features also compels vendors to modify the manufacturing process and design new products compatible with the existing and new standards, which will subsequently propel the market's growth.
The Wire Wedge Bonder Equipment market is a part of the overall semiconductor packaging and assembly equipment market. The shift in semiconductor packaging towards 3D IC technology will intensify the competition between the IDMs and OSATs. The packaging market has a huge potential and provides several growth opportunities to IDMs and OSATs. IDMs are working on expanding into the assembly business, while the OSATs are trying to make use of this opportunity to raise the profit margins. In 2016, IDMs held the maximum market shares during 2016 and this segment is projected to continue its market dominance during the forecasted period as well. The need to increase production capacity and the need to adhere to the constant technological innovation in packaging techniques will be the major factors fueling market growth. Furthermore, the rising R&D activities and the adoption of innovative technologies by the semiconductor packaging industry, will also drive the growth of the Wire Wedge Bonder Equipment market in this end-user segment.
Wire Wedge Bonder Equipment industry is highly concentrated, manufacturers are mostly in the Europe, US and Asia. Among them, Singapore output volume accounted for more than 53.24% of the total output of global Wire Wedge Bonder Equipment in 2016. Kulicke & Soffa is the world leading manufacturer in global Wire Wedge Bonder Equipment market with the market share of 54.19%, in terms of revenue, followed by ASM Pacific Technology (ASMPT), Hesse, Cho-Onpa and F&K Delvotec Bondtechnik. It shows that the Wire Wedge Bonder Equipment market performance is positive, despite the weak economic environment.
The Wire Wedge Bonder Equipment market was valued at 92 Million US$ in 2018 and is projected to reach 100 Million US$ by 2025, at a CAGR of 1.1% during the forecast period. In this study, 2018 has been considered as the base year and 2019 to 2025 as the forecast period to estimate the market size for Wire Wedge Bonder Equipment.
This report presents the worldwide Wire Wedge Bonder Equipment market size (value, production and consumption), splits the breakdown (data status 2014-2019 and forecast to 2025), by manufacturers, region, type and application.
This study also analyzes the market status, market share, growth rate, future trends, market drivers, opportunities and challenges, risks and entry barriers, sales channels, distributors and Porter's Five Forces Analysis.
The following manufacturers are covered in this report:
Kulicke & Soffa
ASM Pacific Technology (ASMPT)
F&K Delvotec Bondtechnik
Wire Wedge Bonder Equipment Breakdown Data by Type
Wire Wedge Bonder Equipment Breakdown Data by Application
Integrated Device Manufacturers (IDMs)
Outsourced Semiconductor Assembly and Test (OSAT)
Wire Wedge Bonder Equipment Production by Region
Wire Wedge Bonder Equipment Consumption by Region
Rest of Europe
Central & South America
Rest of South America
Middle East & Africa
Rest of Middle East & Africa
The study objectives are:
To analyze and research the global Wire Wedge Bonder Equipment status and future forecast，involving, production, revenue, consumption, historical and forecast.
To present the key Wire Wedge Bonder Equipment manufacturers, production, revenue, market share, and recent development.
To split the breakdown data by regions, type, manufacturers and applications.
To analyze the global and key regions market potential and advantage, opportunity and challenge, restraints and risks.
To identify significant trends, drivers, influence factors in global and regions.
To analyze competitive developments such as expansions, agreements, new product launches, and acquisitions in the market.
In this study, the years considered to estimate the market size of Wire Wedge Bonder Equipment :
History Year: 2014 - 2018
Base Year: 2018
Estimated Year: 2019
Forecast Year: 2019 - 2025
This report includes the estimation of market size for value (million USD) and volume (Units). Both top-down and bottom-up approaches have been used to estimate and validate the market size of Wire Wedge Bonder Equipment market, to estimate the size of various other dependent submarkets in the overall market. Key players in the market have been identified through secondary research, and their market shares have been determined through primary and secondary research. All percentage shares, splits, and breakdowns have been determined using secondary sources and verified primary sources.
For the data information by region, company, type and application, 2018 is considered as the base year. Whenever data information was unavailable for the base year, the prior year has been considered.